Please refer to the below table for different kinds of plates.

Vitrified Bond Plate, integrating the advantages of Resinnoid Bond and Metal Bond, shows excellent cut-ability and improves the work environment by only using water.

Mainly used for double-side lapping machine and used for rough grinding of various materials.

It is a plate made by abrasives that are mixed with high polymer solution. It is best suitable for products with low hardness.

Minimiser economically controls spray time and amount of diamond slurry and lubricant to be used.

After using Diamond Plated Ring, Lapping Gauge Unit is used to measure the flatness of the base plate.

It uniformly disperses the diamond powder of the slurry on the lapping plate, hardening the diamond powder at high rate to prevent chipping or scratching.

By balancing the uneven surface of the lapping plate with diamond plated ring, it uniformly readjusts the surface and maintain flatness.

Spray Nozzle is used to evenly distribute abrasives and lubricants to plate.

It is a flexible weighter used to put pressure on workpiece.

This is an inside gear&circumferential gear of double side Lapping Machine and its function is to make a Carrier rotate.

It is a work jig used for fixing lapping film for hand-lapping.

It is a tool used to adjust the flatness of the plate for double side lapping machine.

It is a running gear that forcibly rotates coniditiong ring.

Condition Ring is used when installing a forceable running gear at the center of the base plate.

It is a ring used for cast iron plate. It fixates products and ensures even distribution of abrasives on the plate.

It is a pump used to evenly distribute slurries such as G.C or abrasives.

A device to supply abrasive slurry such as G.C and Alumina to the lapping plate.

Inner bore polishing machine for various kinds of parts. Automatic and mass production is possible.

Different types of diamond tools for grinding inner bore.

Different types of Diamond Powder are artificial(MA), natural(NAT) and polycrystalline(PC) and etc. We offer a wide range of products from many different countries. Diamond sizes are listed in the table below.

It is a mixed liquid of diamond powder and special lubricants used for Lapping & Polishing.

Colloidal Slica of 0.05μm(Suspension Type) is widely used for grinding the surface of wafer. Colloidal Alumina of 0.05μm(Suspension Type) is used for surface processing. Colloidal Cerium Oxide of 1μm(Suspension Type) is used for glass surface processing.

The lubricant used with the diamond slurry maintains the excellent cutting and uniform dispersion of the diamond; and it can effectively save the lapping time and the amount of diamond slurry.

Diamond Paste in syringe type is usually applied to polishing various shapes of mold

Spray type slurry for polishing.
It is used in a final mirror polishing for metallographic examnation in lab.

Polishing Cloth is used together with derivative products of Diamond Powder and applied to mirror-like finishing of various products.

High-precision grinding, polishing and lapping of semiconductors, ceramics and precision machine parts

Vitrified Bond Plate, integrating the advantages of Resinnoid Bond and Metal Bond, shows excellent cut-ability and improves the work environment by only using water.

Diamond Paste is usually applied to polishing various shapes of mold and the like. Paste for manual use.

Stand type is favorable for measuring band of a big-size product.

Optical Lens & FMD(Fluorescent Monochromatic Diffusion) Lamp

Carrier fixes workpiece during machining and prevents chipping from colliding with each other.

Cerium pad is a foam urethane pad mixed with Cerium Powder and other polishing agent, and is applied to ultra high precision polishing of LCD Glass.

Glass Holder is used to fix a product to be grinded and is available or 0.3t or above.

Lapping & Polishing plates for laboratory use. Diamond uniformly and jet diamond at plate uniformly and execute diamond pellet evenly.

Small Lapping & Polishing machine for laboratory use
It is machine that give a luster to the crystalloid surface in uniform thickness.
Equipping a work table and washing ball make its use easy.

Various surface treated pads and film products.

Use in Standard Drilling, Milling, Honing

It is lapping and polishing work that requires even dispersion and when working with a polishing cloth.

PCD, PCBN cutting tool

It is a Truing of whetstone & Dressing's Tool

A flatness of under 1㎛ can result a Ceramic Plate Stainless products of high density.

These plates are standard plate of Lapping machine which our company handle and has various sorts as high precision lap plate and could be applied to wide range of materials.

This is elasticity whetstone on sponge made by Acetal of Polyvinyl Alcohol as bonding agent.

A conditioning way of existing plate flat used Diamond plated rings or Ceramic rings.
This machine supplement that to get conditioning automatically without ring.

Water Cooling Unit drops the temperature of a whole plate by sweeping a water cooling of a uniform temperature into a lower plate, then the water cooling becomes hot. Then it returns cooled in the chiller.

It is a machine that separates and discharges liquid and particles of the workpiece sludge which is generated during the product processing, using a strong centrifugal force.

A dust cover prevent the liquid from blowing away or dust attaching to the workpiece. Like this, It is used to separate the workpiece from an external environment.

This machine, which is the HLI-50 type, is a flatness measuring instrument, applying the principle of Fizeau optical interception.

It is used to remove the lap of the shaft (mandrel) or pull the shaft (mandrel) when it is over extended.