[Colloidal]
Colloidal
Colloidal Slica of 0.05μm(Suspension Type) is widely used for grinding the surface of wafer. Colloidal Alumina of 0.05μm(Suspension Type) is used for surface processing. Colloidal Cerium Oxide of 1μm(Suspension Type) is used for glass surface processing.
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| Colloidal Silica (Suspension Type) |
The particle size of 0.05㎛ is widely used, and has an outstanding performance especially on wafer surface processing. |
|---|---|
| Colloidal Alumina (Suspension Type) |
The particle size of 0.05 ㎛ is widely used, and it is mainly used for surface processing of materials. |
| Cooloidal Cerium Oxide (Suspension Type) |
The particle size of 1μm is widely used, and it is especially excellent for glass surface processing. |
Plate Type & Purpose
| Particle Size | 1/10μ | 1/4μ | 1/2μ | 1μ | 2μ | 3μ | 6μ | 9μ | 15μ | 30μ | 45μ | 60μ | #230 | #170 | #100 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Micron Size | 0~1/5 | 0~1/2 | 0~1 | 0~2 | 1~3 | 2~4 | 4~8 | 6~12 | 10~12 | 22~36 | 36~54 | 54~80 | |||
| Mesh Size | 240,000 | 100,000 | 60,000 | 14,000 | 11,000 | 8,000 | 3,000 | 1,800 | 1,200 | 600 | 325 | 270 | 230 | 170 | 100 |
※ Apart from the sizes mentioned above, special grade orders are also available.